Invention Grant
- Patent Title: Sputtering cathode, sputtering cathode assembly, and sputtering apparatus
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Application No.: US17106526Application Date: 2020-11-30
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Publication No.: US11081324B2Publication Date: 2021-08-03
- Inventor: Hiroshi Iwata
- Applicant: Keihin Ramtech Co., Ltd.
- Applicant Address: JP Kamakura
- Assignee: Keihin Ramtech Co., Ltd.
- Current Assignee: Keihin Ramtech Co., Ltd.
- Current Assignee Address: JP Kamakura
- Agency: Potomac Law Group, PLLC
- Agent Kenneth Fagin
- Priority: JP2018-084619 20180426,JP2018-091046 20180510,JP2018-091047 20180510
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34 ; C23C14/35

Abstract:
The sputtering cathode has a tubular shape having a pair of long sides facing each other in cross-sectional shape, has a sputtering target whose erosion surface faces inward, and a magnetic circuit is provided along the sputtering target. The pair of long sides are constituted by rotary targets each having a cylindrical shape. The rotary target is internally provided with a magnetic circuit and configured to allow the flow of cooling water. The magnetic circuit is provided parallel to the central axis of the rotary target and has a rectangular cross-sectional shape having a long side perpendicular to the radial direction of the rotary target.
Public/Granted literature
- US20210082674A1 Sputtering Cathode, Sputtering Cathode Assembly, and Sputtering Apparatus Public/Granted day:2021-03-18
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