Invention Grant
- Patent Title: Method of forming film on substrate and method of manufacturing liquid ejection head
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Application No.: US16268901Application Date: 2019-02-06
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Publication No.: US11081349B2Publication Date: 2021-08-03
- Inventor: Masaya Uyama , Souta Takeuchi , Taichi Yonemoto , Kazuaki Shibata , Atsushi Teranishi , Takeru Yasuda , Atsunori Terasaki
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: JP2018-030888 20180223,JPJP2018-202746 20181029
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/027 ; H01L21/02
Abstract:
Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.
Public/Granted literature
- US20200227252A1 METHOD OF FORMING FILM ON SUBSTRATE AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD Public/Granted day:2020-07-16
Information query
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