Invention Grant
- Patent Title: Guard ring structure of semiconductor arrangement
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Application No.: US16713465Application Date: 2019-12-13
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Publication No.: US11081363B2Publication Date: 2021-08-03
- Inventor: Sheng-Fang Cheng , Chen-Chih Wu , Chien-Yuan Lee , Yen-Lin Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/3205 ; H01L29/78 ; H01L29/423 ; H01L29/06 ; H01L21/8234 ; H01L27/088 ; H01L21/265 ; H01L21/768
Abstract:
Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring.
Information query
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