A ceramic structure includes a ceramic base member having a main face; a hole extending from the main face into the ceramic base member; a metal electrode layer embedded in the ceramic base member; a conductive member embedded in the ceramic base member so as to be electrically connected to the metal electrode layer and form a bottom of the hole; a first metal member joined to the conductive member by a brazing material and having an average linear expansion coefficient not less than the average linear expansion coefficient of the conductive member; one or a plurality of second metal members having a greater average linear expansion coefficient than the first metal member; and a metal terminal joined to the one or the plurality of second metal members and having a greater average linear expansion coefficient than each second metal member.