Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16796557Application Date: 2020-02-20
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Publication No.: US11081412B2Publication Date: 2021-08-03
- Inventor: Takenori Yamada , Tomohiro Iguchi
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: White & Case LLP
- Priority: JPJP2019-169906 20190918
- Main IPC: H01L23/15
- IPC: H01L23/15 ; H01L23/14 ; H01L23/492
Abstract:
A semiconductor device of embodiments includes a first semiconductor chip; a metal plate having a first plane and a second plane facing the first plane and including a first ceramic plate provided between the first plane and the second plane; and a first insulating board provided between the first semiconductor chip and the metal plate and facing the first plane, in which the first ceramic plate does not exist between the first semiconductor chip and the second plane.
Public/Granted literature
- US20210082781A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-03-18
Information query
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