Invention Grant
- Patent Title: Semiconductor package and a method of manufacturing the same
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Application No.: US16293936Application Date: 2019-03-06
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Publication No.: US11081419B2Publication Date: 2021-08-03
- Inventor: Jae Sik Choi , Dong Seong Oh , Si Hyeon Go
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR10-2016-0161106 20161130
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/00 ; H01L21/56 ; H01L21/48 ; H01L23/485 ; H01L23/544 ; H01L23/433 ; H01L23/31
Abstract:
A method to manufacture a semiconductor package includes: preparing a metal substrate; attaching semiconductor dies to the metal substrate at an interval; attaching a bonding film to the semiconductor dies; applying a mold material on the semiconductor dies and the metal substrate, and curing the mold material to form a mold member; grinding the mold member and the metal substrate to a thickness; removing the bonding film; attaching a redistribution layer to the semiconductor dies; and cutting between the semiconductor dies.
Public/Granted literature
- US20190198415A1 SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-06-27
Information query
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