Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US16374320Application Date: 2019-04-03
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Publication No.: US11081491B2Publication Date: 2021-08-03
- Inventor: Hiraku Chakihara
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2018-081759 20180420
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L27/11565 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L21/66 ; H01L23/522 ; H01L21/28

Abstract:
There is provided a semiconductor device including a first gate pattern on a semiconductor substrate, a second gate pattern adjacent to a side surface of the first gate pattern via an ONO film, and an active region located just below the second gate pattern via the ONO film. Here, an element isolation region is formed just below the first gate pattern. In this manner, capacitance between the first gate pattern and the semiconductor substrate and capacitance between the first and second gate patterns are prevented from being measured when measuring capacitance between the second gate pattern which is an upper electrode and the active region which is a lower electrode in order to measure a film thickness of the ONO film just below the second gate pattern.
Public/Granted literature
- US20190326311A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-10-24
Information query
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