Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US16857647Application Date: 2020-04-24
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Publication No.: US11081492B2Publication Date: 2021-08-03
- Inventor: Tetsuaki Utsumi
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-016330 20170131
- Main IPC: H01L27/11568
- IPC: H01L27/11568 ; H01L27/11582 ; H01L25/065 ; G11C5/04 ; H01L23/00 ; H01L29/792 ; H01L27/11578 ; H01L21/822 ; H01L21/28 ; G11C29/02 ; H01L27/11573 ; H01L27/11575 ; G11C29/04

Abstract:
A semiconductor memory device includes a semiconductor substrate, transistors formed in an upper surface of the semiconductor substrate, a stacked body provided on the semiconductor substrate, a first contact, and a second contact. The transistors are arranged along a first direction. A minimum period of an arrangement of the transistors is a first period. The stacked body includes electrode films. A configuration of a first portion of the stacked body is a staircase-like having terraces. A first region and a second region are set along the first direction in the first portion. A length in the first direction of the terrace disposed in the second region is longer than the first period. A length in the first direction of the terrace disposed in the first region is shorter than the first period.
Public/Granted literature
- US20200251483A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2020-08-06
Information query
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