Invention Grant
- Patent Title: Semiconducting device, and appliance having the semiconducting device
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Application No.: US17018671Application Date: 2020-09-11
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Publication No.: US11081515B2Publication Date: 2021-08-03
- Inventor: Takehiko Soda , Kazutoshi Torashima , Yasushi Nakata
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JPJP2018-068576 20180330
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/498
Abstract:
A first conductive pattern and a third conductive pattern are joined to each other in a junction plane, and a second conductive pattern and a fourth conductive pattern are joined to each other in the junction plane, and an insulation layer is arranged at least in one of spaces between the first conductive pattern and the second conductive pattern and between the third conductive pattern and the fourth conductive pattern.
Information query
IPC分类:
