Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16678808Application Date: 2019-11-08
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Publication No.: US11081589B2Publication Date: 2021-08-03
- Inventor: Mark Van Dal
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L29/786 ; H01L29/423 ; H01L29/10 ; H01L29/06 ; H01L29/66 ; H01L29/775

Abstract:
A semiconductor device includes a substrate, an N-type bottom vertical gate-all-around (VGAA) transistor, a P-type bottom VGAA transistor, and a top VGAA transistor. The N-type bottom vertical gate-all-around (VGAA) transistor is over the semiconductor substrate and comprising a first nanowire made of InAs. The P-type bottom VGAA transistor is over the semiconductor substrate and comprising a second nanowire made of Ge. The top VGAA transistor is over the N-type bottom VGAA transistor, in which the top VGAA transistor includes a third nanowire in contact with the N-type bottom VGAA transistor, a fourth nanowire on and in contact with the third nanowire, and a bit line wrapping the fourth nanowire.
Public/Granted literature
- US20200075776A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-03-05
Information query
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