Invention Grant
- Patent Title: Assembly of bus bars forming a casing and heat dissipator for an electronic power device
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Application No.: US16975079Application Date: 2019-02-22
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Publication No.: US11081970B2Publication Date: 2021-08-03
- Inventor: Friedbald Kiel
- Applicant: INSTITUT VEDECOM
- Applicant Address: FR Versailles
- Assignee: INSTITUT VEDECOM
- Current Assignee: INSTITUT VEDECOM
- Current Assignee Address: FR Versailles
- Agency: Sandberg Phoenix & von Gontard, P.C.
- Priority: FR1851689 20180227
- International Application: PCT/FR2019/050412 WO 20190222
- International Announcement: WO2019/166721 WO 20190906
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/20 ; H01L23/473 ; H02M7/00 ; H02G5/10

Abstract:
The assembly of bus bars according to the invention comprises a plurality of sectors of bus bars (S1 to S6) which are arranged, in a connected manner and with electrical contact, around a central axis (C) and upper and lower closing plates (BPD) which are perpendicular to the central axis, the sectors of bus bars each comprising an external portion of bus bar (B11 to B16) and at least one internal portion of bus bar (B21 to B26, B31 to B36) which delimit a plurality of internal volumes, the upper and lower closing plates being in contact against upper and lower faces of the portions of bus bar, respectively, and the portions of bus bar comprising a plurality of electrical contact faces of the type referred to as “press pack”.
Information query