Invention Grant
- Patent Title: Heated running board assembly
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Application No.: US16032445Application Date: 2018-07-11
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Publication No.: US11083051B2Publication Date: 2021-08-03
- Inventor: Paul Kenneth Dellock , Aaron Bradley Johnson , Stuart C. Salter , Stephen Kenneth Helwig , Jeffrey Alan Mesko
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Carlson, Gaskey & Olds, P.C.
- Agent David Coppiellie
- Main IPC: H05B3/32
- IPC: H05B3/32 ; B60R3/00 ; B60S1/66 ; B60R3/02
Abstract:
An exemplary running board assembly includes a running board with a deck having a plurality of spaced-apart raised sections. The raised sections are made of a thermally conductive polymer and include an electrically conductive element configured to allow electric current to flow through the raised sections.
Public/Granted literature
- US20200022225A1 HEATED RUNNING BOARD ASSEMBLY AND METHOD Public/Granted day:2020-01-16
Information query
