Invention Grant
- Patent Title: Electronic package comprising a decoupling layer structure
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Application No.: US16687068Application Date: 2019-11-18
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Publication No.: US11083081B2Publication Date: 2021-08-03
- Inventor: Mikael Tuominen , Seok Kim Tay
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN201811384891.X 20181120
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K1/18 ; H05K3/46
Abstract:
An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
Public/Granted literature
- US20200163206A1 Electronic Package Comprising a Decoupling Layer Structure Public/Granted day:2020-05-21
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