Invention Grant
- Patent Title: Insulated metal substrate and manufacturing method thereof
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Application No.: US16711450Application Date: 2019-12-12
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Publication No.: US11083087B2Publication Date: 2021-08-03
- Inventor: Chun-Ta Yeh , Kuo-Pin Cheng , Chin-Long Lin
- Applicant: Jentech Precision Industrial Co., LTD.
- Applicant Address: TW Taoyuan
- Assignee: Jentech Precision Industrial Co., LTD.
- Current Assignee: Jentech Precision Industrial Co., LTD.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW108101055 20190110
- Main IPC: H05K3/20
- IPC: H05K3/20 ; H05K1/05 ; H05K3/10 ; H05K1/02

Abstract:
An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.
Public/Granted literature
- US20200229303A1 INSULATED METAL SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-07-16
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