Invention Grant
- Patent Title: Method of forming a component
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Application No.: US16302490Application Date: 2016-05-18
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Publication No.: US11090770B2Publication Date: 2021-08-17
- Inventor: Dheepa Srinivasan , Dayananda Narayana , Kaustubh Krishna Bawane , Joydeep Pal , Mariusz Strzyzewski , Tomasz Szewczyk , David Edward Schick
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Agency: Hoffman Warnick LLC
- Agent James Pemrick
- International Application: PCT/PL2016/050020 WO 20160518
- International Announcement: WO2017/200401 WO 20171123
- Main IPC: B23P6/00
- IPC: B23P6/00 ; B22F5/04 ; F01D5/00 ; F01D5/18 ; B23K26/342 ; B22F7/06 ; B22F7/08 ; B23K26/14 ; B23K26/144 ; B22F10/20 ; B23K101/00 ; B23K103/18

Abstract:
A component and method of forming a component are disclosed. The component includes a cast alloy section and an additive manufacturing section secured to the cast alloy section. Both the cast alloy section and the additive manufacturing section form at least a portion of an outer surface of the component. The method of forming a component includes removing a portion of an existing component, the removing of the portion forming an open section in the existing component, forming an article through an additive manufacturing technique, the article having a shape and geometry arranged and disposed to fill the open section in the existing component, and securing the article within the open section of the existing component to form the component. Another method includes directly depositing a material, by an additive manufacturing technique, over a portion of the existing component.
Public/Granted literature
- US20190176273A1 COMPONENT AND METHOD OF FORMING A COMPONENT Public/Granted day:2019-06-13
Information query