A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.