Invention Grant
- Patent Title: Camera module, molding photosensitive assembly thereof, manufacturing method thereof and electronic device
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Application No.: US16604715Application Date: 2018-04-12
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Publication No.: US11094727B2Publication Date: 2021-08-17
- Inventor: Mingzhu Wang , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Bojie Zhao
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: CN201710236249.6 20170412
- International Application: PCT/CN2018/082819 WO 20180412
- International Announcement: WO2018/188628 WO 20181018
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; B29C45/14 ; H01L21/56 ; H04N5/369 ; B29L31/34
Abstract:
Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.
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