Invention Grant
- Patent Title: Resin composition and use thereof
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Application No.: US16320265Application Date: 2017-07-27
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Publication No.: US11098229B2Publication Date: 2021-08-24
- Inventor: Kohei Ueda , Koji Ishiwata , Yasutoyo Kawashima
- Applicant: Sumitomo Chemical Company, Limited
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company, Limited
- Current Assignee: Sumitomo Chemical Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JPJP2016-150490 20160729
- International Application: PCT/JP2017/027223 WO 20170727
- International Announcement: WO2018/021467 WO 20180201
- Main IPC: C09K5/06
- IPC: C09K5/06 ; C08L23/08 ; C08L101/12 ; C08K5/00

Abstract:
A resin composition contains a polymer whose enthalpy of fusion (ΔH) observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J/g or more; and a low-molecular-weight compound whose enthalpy of fusion (ΔH) observed within a temperature range of 0° C. or higher and lower than 100° C. in differential scanning calorimetry is 30 J/g or more and whose molecular weight is 2000 or lower. A content of the low-molecular-weight compound is 3 parts by weight to 1000 parts by weight with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition except the low-molecular-weight compound.
Public/Granted literature
- US20190270923A1 RESIN COMPOSITION AND USE THEREOF Public/Granted day:2019-09-05
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