Invention Grant
- Patent Title: Wavelength conversion module and projection device
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Application No.: US16851074Application Date: 2020-04-16
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Publication No.: US11099378B2Publication Date: 2021-08-24
- Inventor: Pi-Tsung Hsu , Chi-Tang Hsieh
- Applicant: Coretronic Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: Coretronic Corporation
- Current Assignee: Coretronic Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: JCIPRNET
- Priority: CN201910317653.5 20190419
- Main IPC: H04N9/31
- IPC: H04N9/31 ; G02B26/00 ; G03B21/20 ; C09K11/02 ; H01L33/50

Abstract:
A wavelength conversion module and a projection device are provided. The wavelength conversion module includes a substrate, a wavelength conversion layer and a thermal conductive adhesive layer. The wavelength conversion layer is located on the substrate. The thermal conductive adhesive layer is located between the wavelength conversion layer and the substrate. The thermal conductive adhesive layer includes a plurality of particles, the particles are distributed in the thermal conductive adhesive layer, and a particle concentration of the particles has a volume ratio greater than 0% and less than or equal to 80%.
Public/Granted literature
- US20200333583A1 WAVELENGTH CONVERSION MODULE AND PROJECTION DEVICE Public/Granted day:2020-10-22
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