Invention Grant
- Patent Title: Semiconductor die package including a one-body clip
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Application No.: US16804662Application Date: 2020-02-28
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Publication No.: US11101198B2Publication Date: 2021-08-24
- Inventor: Seungwon Im , Joonseo Son , Oseob Jeon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/38 ; H01L23/433 ; H01L23/373 ; H01L23/40 ; H01L23/31
Abstract:
In one general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate and defining an opening. The apparatus can include a one-body clip having a first portion disposed within the opening and coupled to the semiconductor die. The one-body clip can have a second portion disposed within the same opening and coupled to the substrate.
Public/Granted literature
- US3141103A Electric control device for electromagnetic clutch Public/Granted day:1964-07-14
Information query
IPC分类:
