Invention Grant
- Patent Title: Package-on-package structure and manufacturing method thereof
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Application No.: US16548817Application Date: 2019-08-22
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Publication No.: US11101252B2Publication Date: 2021-08-24
- Inventor: Shih-Ting Lin , Chin-Fu Kao , Jing-Cheng Lin , Li-Hui Cheng , Szu-Wei Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L25/10 ; H01L25/00 ; H01L23/538 ; H01L21/56 ; H01L21/48
Abstract:
A package-on-package structure including a first and second package is provided. The first package includes a semiconductor die, through insulator vias, an insulating encapsulant, conductive terminals and a redistribution layer. The semiconductor die has a die height H1. The plurality of through insulator vias is surrounding the semiconductor die and has a height H2, and H2
Public/Granted literature
- US1246679A Lock-nut. Public/Granted day:1917-11-13
Information query
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