An electronic device includes a signal processor, a substrate, and a conductive housing. The signal processor includes an oscillator that outputs oscillation signal. The substrate has a ground component, the signal processor being disposed on the substrate. The conductive housing is connected to a first site of the ground component and to a second site that is different from the first site. The first site and the second site are disposed at positions where a first area of the housing that is an odd-numbered multiple of ¼ wavelength of the oscillation signal away from the first site overlaps at least part of a second area of the housing that is a multiple of ¼ wavelength of the oscillation signal away from the second site.