Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16117791Application Date: 2018-08-30
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Publication No.: US11107614B2Publication Date: 2021-08-31
- Inventor: Soon Kwang Kwon , Jung Ho Cho , Jung Wook Seo , Young Seuck Yoo , Joong Won Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0019794 20180220
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F5/00 ; H01F27/06 ; H01F5/04 ; H01F17/00

Abstract:
A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.
Public/Granted literature
- US20190259519A1 COIL ELECTRONIC COMPONENT Public/Granted day:2019-08-22
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