A semiconductor device may include a first conductive plate, a plurality of semiconductor chips disposed on the first conductive plate, and a first external connection terminal connected to the first conductive plate. The plurality of semiconductor chips may include first, second, and third semiconductor chips. The second semiconductor chip may be located between the first semiconductor chip and the third semiconductor chip. A portion of the first conductive plate where the first external connection terminal is connected may be closest to the second semiconductor chip among the first, second, and third semiconductor chips. The first conductive plate may be provided with an aperture located between the portion of the first conductive plate where the first external connection terminal is connected and a portion of the first conductive plate where the second semiconductor chip is connected.