Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16441366Application Date: 2019-06-14
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Publication No.: US11107887B2Publication Date: 2021-08-31
- Inventor: Hidenori Fujii
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-189414 20181004
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/08 ; H01L29/868 ; H01L29/739

Abstract:
A semiconductor device includes: an n-type semiconductor substrate having a cell region and a termination region provided around the cell region; a p-type anode layer provided on an upper surface of the n-type semiconductor substrate in the cell region; an n-type buffer layer provided on a lower surface of the n-type semiconductor substrate; and a p-type layer provided on the lower surface of the n-type buffer layer in the termination region and deeper than the n-type buffer layer.
Information query
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