Invention Grant
- Patent Title: Group III nitride semiconductor light emitting element and method of manufacturing the same
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Application No.: US16497564Application Date: 2018-03-23
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Publication No.: US11107952B2Publication Date: 2021-08-31
- Inventor: Yasuhiro Watanabe
- Applicant: DOWA Electronics Materials Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: DOWA Electronics Materials Co., Ltd.
- Current Assignee: DOWA Electronics Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenja IP Law PC
- Priority: JPJP2017-061733 20170327
- International Application: PCT/JP2018/011845 WO 20180323
- International Announcement: WO2018/181044 WO 20181004
- Main IPC: H01L33/32
- IPC: H01L33/32 ; H01L33/00 ; H01L33/06 ; H01L33/12 ; H01L33/14 ; H01L33/40

Abstract:
Provided are a group III nitride semiconductor light emitting element and a method of manufacturing the same. A group III nitride semiconductor light emitting element of the present disclosure comprises in this order, in a substrate, an n-type semiconductor layer, a light emitting layer, a p-type electron blocking layer, a p-type contact layer made of AlxGa1-xN, and a p-side reflection electrode, wherein a center emission wavelength of light emitted from the light emitting layer is 270 nm or greater and 330 nm or smaller, the p-type contact layer is in contact with the p-side reflection electrode, and has a thickness of 20 nm or greater and 80 nm or smaller, and the Al composition ratio x of the p-type contact layer satisfies the following Formula: 2.09−0.006×λp≤x≤2.25−0.006×λp where λp is the center emission wavelength in nanometer.
Public/Granted literature
- US20200287087A1 GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-09-10
Information query
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