The present disclosure provides an organic light emitting diode display package structure and a method of manufacturing the same. The organic light emitting diode display package structure is provided with a gate insulating layer, a first barrier layer, a first organic buffer layer, a first hydrophobic layer, a second organic buffer layer, and a second barrier layer which are disposed sequentially. A double layer of the organic buffer layer has a thickness capable of wrapping the foreign matters in the area to lower the possibility that the water and oxygen pass through this area and enter OLED device to enhance the protection ability of the TFE on the OLED device.