An antenna-integrated wireless module comprises a substrate having a first surface and including a wireless region and an antenna region. A wireless functional section is in the wireless region and includes an RF circuit on the first surface or in the substrate. An antenna section is in the antenna region and includes an antenna conductor. A resin sealing layer covers at least a part of the first surface. A thickness of the resin sealing layer in a portion overlapping the antenna region may be thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region such that the resin sealing layer may have a step at a location between the wireless region and the antenna region; or the substrate may have a step at a boundary between the wireless region and the antenna region, and the resin sealing layer may not the cover the step.