Invention Grant
- Patent Title: Electronic device with housing storing electronic component
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Application No.: US16298268Application Date: 2019-03-11
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Publication No.: US11108178B2Publication Date: 2021-08-31
- Inventor: Nobuhiro Yamamoto , Kiyokazu Ishizaki , Kota Tokuda , Yousuke Hisakuni
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: White & Case LLP
- Priority: JPJP2018-174649 20180919
- Main IPC: H01R12/78
- IPC: H01R12/78 ; G11B33/14 ; H01R12/79 ; H01R13/24 ; H05K1/11 ; H01R12/70

Abstract:
According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.
Public/Granted literature
- US20200091641A1 ELECTRONIC DEVICE Public/Granted day:2020-03-19
Information query
IPC分类: