Invention Grant
- Patent Title: Electronic device including acoustic module
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Application No.: US16662811Application Date: 2019-10-24
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Publication No.: US11109144B2Publication Date: 2021-08-31
- Inventor: Seonguk Park , Kyungmoon Kang , Juhwan Kim , Hyunsuk Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2018-0159792 20181212
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04M1/02

Abstract:
An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate, and a lateral member surrounding a space between the front and rear plates and having at least one through-hole. The electronic device further includes a display disposed to be seen through the front plate, and a speaker structure disposed near the through-hole in the space between the display and the rear plate. The speaker structure includes a yoke disposed between the display and the rear plate and facing the display, a diaphragm disposed between the rear plate and the yoke and spaced apart from the rear plate, a magnet disposed between the yoke and the diaphragm, a speaker housing surrounding, at least in part, at least one of the diaphragm, the yoke, or the magnet and including a first opening formed toward the rear plate and a second opening formed toward the through-hole. The electronic device further includes a sealing member disposed between the speaker housing and the rear plate and surrounding the first opening when viewed from the rear plate. A sound conduit includes, between the diaphragm and the through-hole, a first space formed by the first opening, the rear plate, and the sealing member, and a second space connected to the first space through the second opening.
Public/Granted literature
- US11076221B2 Electronic device including acoustic module Public/Granted day:2021-07-27
Information query
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