Invention Grant
- Patent Title: Cushion pin pressure equalizing device, die cushion device with cushion pin pressure equalizing function and cushion pin pressure equalizing method
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Application No.: US16291363Application Date: 2019-03-04
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Publication No.: US11110505B2Publication Date: 2021-09-07
- Inventor: Yasuyuki Kohno
- Applicant: AIDA ENGINEERING, LTD.
- Applicant Address: JP Kanagawa
- Assignee: AIDA ENGINEERING, LTD.
- Current Assignee: AIDA ENGINEERING, LTD.
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2018-038745 20180305
- Main IPC: B21D24/02
- IPC: B21D24/02 ; B21D24/08 ; B21D24/14

Abstract:
A cushion pin pressure equalizing device that can absorb a variation in height of a plurality of cushion pins and control a die cushion load highly accurately, a die cushion device, and a cushion pin pressure equalizing method are provided. An initial pressure in ascending-side pressurizing chambers of a pressure equalizing hydraulic cylinder group for absorbing a variation in height of cushion pins is controlled so as to be an appropriate pressure. The variation in height of the plurality of cushion pins can be absorbed within a shortest stroke of a slide after the slide comes into collision with a cushion pad so as to equalize die cushion loads that are applied individually to the cushion pins and a target die cushion load can be generated within the shortest stroke of the slide, whereby a response to application of the die cushion load can be stabilized without excessive delay.
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