Invention Grant
- Patent Title: Damper mount
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Application No.: US16787665Application Date: 2020-02-11
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Publication No.: US11110768B2Publication Date: 2021-09-07
- Inventor: Yuho Ito , Toshio Inoue
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JPJP2019-025088 20190215
- Main IPC: B60G13/00
- IPC: B60G13/00 ; B60G13/08 ; B60G15/06 ; F16F9/54 ; F16F15/08 ; F16F1/36 ; F16F15/03 ; F16F15/023

Abstract:
Provided is a damper mount (1, 101, 201) configured to be interposed between a damper (11) of a wheel suspension device and a vehicle body (9). The damper mount includes: an annular outer member (22) fixed to the vehicle body; an annular inner member (21) fixed to the damper, one of the outer member and the inner member being received in another of the outer member and the inner member; a first magneto-elastic member (24) radially interposed between the inner member and the outer member; and a coil (25) configured to apply a magnetic flux to the first magneto-elastic member.
Public/Granted literature
- US20200262260A1 DAMPER MOUNT Public/Granted day:2020-08-20
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