Invention Grant
- Patent Title: Method for treating surface of resin material layer and resin material
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Application No.: US16305155Application Date: 2017-03-31
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Publication No.: US11111348B2Publication Date: 2021-09-07
- Inventor: Koichi Hasegawa , Toshio Abe , Kiyoka Takagi , Takashi Nishino , Takuya Matsumoto , Akira Miyagaki
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. , National University Corporation KOBE University
- Applicant Address: JP Tokyo; JP Hyogo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.,National University Corporation KOBE University
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.,National University Corporation KOBE University
- Current Assignee Address: JP Tokyo; JP Hyogo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2016-109228 20160531
- International Application: PCT/JP2017/013544 WO 20170331
- International Announcement: WO2017/208608 WO 20171207
- Main IPC: C08J7/12
- IPC: C08J7/12
Abstract:
A method is for treating a surface of a resin material layer. The method includes a first step of introducing as a substituent at least one selected from the group consisting of an acid halide and an alkyl halide into an aromatic polyether-based resin included in the resin material layer by Friedel-Crafts reaction.
Public/Granted literature
- US20200317876A1 METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL Public/Granted day:2020-10-08
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