Invention Grant
- Patent Title: Epoxy resin composition
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Application No.: US16476721Application Date: 2018-01-09
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Publication No.: US11111382B2Publication Date: 2021-09-07
- Inventor: Noriaki Fukuda , Ryota Harisaki , Katsumasa Yamamoto
- Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Applicant Address: JP Hyogo
- Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Current Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Current Assignee Address: JP Hyogo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-002211 20170110
- International Application: PCT/JP2018/000192 WO 20180109
- International Announcement: WO2018/131563 WO 20180719
- Main IPC: C08L71/12
- IPC: C08L71/12 ; C08G59/02 ; H05K1/03 ; C08G59/32 ; C08G59/30 ; C08L63/00 ; H01L23/29
Abstract:
Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.
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