Invention Grant
- Patent Title: Polishing composition, method for producing polishing composition, and polishing method
-
Application No.: US16316970Application Date: 2017-06-12
-
Publication No.: US11111412B2Publication Date: 2021-09-07
- Inventor: Shota Suzuki , Yoshihiro Izawa
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu
- Agency: Foley & Lardner LLP
- Priority: JPJP2016-140624 20160715
- International Application: PCT/JP2017/021691 WO 20170612
- International Announcement: WO2018/012173 WO 20180118
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; B24B37/00 ; H01L21/3105
Abstract:
The present invention provides a polishing composition which can polish an object to be polished at a high polishing speed and with fewer scratches (defects). The present invention is a polishing composition containing silica of which a maximum peak height in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower is −0.011 or more and less than 0, a pH at 25° C. of the polishing composition being less than 6.0.
Public/Granted literature
- US20190225836A1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND POLISHING METHOD Public/Granted day:2019-07-25
Information query
