Invention Grant
- Patent Title: Single crystal silicon ingot having axial uniformity
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Application No.: US16570010Application Date: 2019-09-13
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Publication No.: US11111596B2Publication Date: 2021-09-07
- Inventor: Carissima Marie Hudson , Jae-Woo Ryu
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Armstrong Teasdale LLP
- Main IPC: C30B29/06
- IPC: C30B29/06 ; C30B15/00 ; C30B15/20 ; C30B15/04 ; C30B15/10

Abstract:
A method for growing a single crystal silicon ingot by the continuous Czochralski method is disclosed. The melt depth and thermal conditions are constant during growth because the silicon melt is continuously replenished as it is consumed, and the crucible location is fixed. The critical v/G is determined by the hot zone configuration, and the continuous replenishment of silicon to the melt during growth enables growth of the ingot at a constant pull rate consistent with the critical v/G during growth of a substantial portion of the main body of the ingot. The continuous replenishment of silicon is accompanied by periodic or continuous nitrogen addition to the melt to result in a nitrogen doped ingot.
Public/Granted literature
- US20210079553A1 SINGLE CRYSTAL SILICON INGOT HAVING AXIAL UNIFORMITY Public/Granted day:2021-03-18
Information query
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