Invention Grant
- Patent Title: Heat pipe heatsink with internal structural support plate
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Application No.: US17010599Application Date: 2020-09-02
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Publication No.: US11112186B2Publication Date: 2021-09-07
- Inventor: Yosuke Watanabe , Kenya Kawabata , Yoshikatsu Inagaki , Tatsuro Miura , Kazuaki Aotani , Toshiaki Nakamura
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2019-079602 20190418
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; F28D15/04

Abstract:
A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.
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