Invention Grant
- Patent Title: Saw based optical sensor device and package including the same
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Application No.: US16183545Application Date: 2018-11-07
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Publication No.: US11112352B2Publication Date: 2021-09-07
- Inventor: Jin Woo Lee , Byung Moon Lee , Jin Kee Hong , Jong Woo Kim
- Applicant: HAESUNG DS CO., LTD.
- Applicant Address: KR Changwon-si
- Assignee: HAESUNG DS CO., LTD.
- Current Assignee: HAESUNG DS CO., LTD.
- Current Assignee Address: KR Changwon-si
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Priority: KR10-2018-0040004 20180405
- Main IPC: G01N21/17
- IPC: G01N21/17 ; H05K1/02 ; G01L9/00 ; G01K11/26 ; H05K3/28 ; H05K1/18

Abstract:
Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.
Public/Granted literature
- US20190310183A1 OPTICAL SENSOR DEVICE AND PACKAGE INCLUDING THE SAME Public/Granted day:2019-10-10
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