Invention Grant
- Patent Title: Probe head and electronic device testing system
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Application No.: US16366197Application Date: 2019-03-27
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Publication No.: US11112430B2Publication Date: 2021-09-07
- Inventor: Anil Kaza , Donald E. Edenfeld , Todd P. Albertson , Patrick Whiting
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G01R3/00
- IPC: G01R3/00 ; G01R1/073 ; G01R1/067

Abstract:
A probe head may be utilized to test an electronic device. The probe head may include a probe axis extending along a length of the probe head. The probe head may include a probe core including a first metal. The probe core may include a core surface having a first dimension. The first dimension may be perpendicular to the probe axis. The probe core may include a probe tip, for instance extending from the core surface along the probe axis. The probe tip has a second dimension that may be perpendicular to the probe axis. The second dimension may be less than the first dimension of the core surface. The probe head may include a cladding layer that includes a second metal. The cladding layer may be coupled around a perimeter of the probe core. The probe tip may extend beyond the cladding layer.
Public/Granted literature
- US20200309818A1 PROBE HEAD AND ELECTRONIC DEVICE TESTING SYSTEM Public/Granted day:2020-10-01
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