Invention Grant
- Patent Title: Shield conduction path
-
Application No.: US16472320Application Date: 2017-12-25
-
Publication No.: US11114217B2Publication Date: 2021-09-07
- Inventor: Hidetoshi Sugino
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Yokkaichi
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Yokkaichi
- Agency: Oliff PLC
- Priority: JPJP2017-003226 20170112
- International Application: PCT/JP2017/046344 WO 20171225
- International Announcement: WO2018/131448 WO 20180719
- Main IPC: H01B7/20
- IPC: H01B7/20 ; H01B7/18 ; H02G3/04 ; H05K9/00

Abstract:
A shield conduction path that includes a wire; and a pipe with a circular cross-section that accommodates the wire. The pipe is formed by combining a first divided body and a second divided body that are divided in a diameter direction using, as boundaries, divided surfaces that extend in an axial direction of the pipe. The first divided body and the second divided body include a metal material that can be held in a combined state through welding, and a circumferential length of the first divided body is set to be longer than a circumferential length of the second divided body.
Public/Granted literature
- US20200350097A1 SHIELD CONDUCTION PATH Public/Granted day:2020-11-05
Information query