Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US16933068Application Date: 2020-07-20
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Publication No.: US11114241B2Publication Date: 2021-09-07
- Inventor: Do Yeon Kim , Je Jung Kim , Do Young Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0120591 20181010
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232 ; H01G4/12

Abstract:
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.
Public/Granted literature
- US20200350122A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2020-11-05
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