Invention Grant
- Patent Title: Controlling of height of high-density interconnection structure on substrate
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Application No.: US16141153Application Date: 2018-09-25
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Publication No.: US11114308B2Publication Date: 2021-09-07
- Inventor: Keishi Okamoto , Akihiro Horibe , Hiroyuki Mori
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Randall Bluestone
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L25/00 ; H01L23/00 ; H01L23/498
Abstract:
An interconnection layer carrying structure for transferring an interconnection layer onto a substrate is disclosed. The interconnection layer carrying structure includes a support substrate, a release layer on the support substrate; and an interconnection layer on the release layer. The interconnection layer includes an organic insulating material and a set of pads embedded in the organic insulating material. The set of the pads is configured to face towards the support substrate. The support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.
Public/Granted literature
- US20200098592A1 CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON SUBSTRATE Public/Granted day:2020-03-26
Information query
IPC分类:
