- Patent Title: Methods for loading or unloading substrate with evaporator planet
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Application No.: US16734540Application Date: 2020-01-06
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Publication No.: US11114329B2Publication Date: 2021-09-07
- Inventor: Michael J. Seddon , Heng Chen Lee
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, LTD.
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/677 ; H01L21/683 ; H01L21/68 ; H01L21/02

Abstract:
Implementations of methods of loading an evaporator may include, using a robotic arm, removing a substrate from a cassette and centering the substrate on a substrate aligner. The method may include aligning the substrate using the substrate aligner. The substrate may also include removing the substrate from the substrate aligner using the robotic arm and loading the substrate into a first available pocket of a planet of an evaporator using the robotic arm. The method may also include rotating the planet to a second available pocket after detecting a presence of the substrate in the first available pocket.
Public/Granted literature
- US20200321235A1 EVAPORATOR SUBSTRATE LOADING SYSTEMS AND RELATED METHODS Public/Granted day:2020-10-08
Information query
IPC分类: