Invention Grant
- Patent Title: Printed wiring board, printed circuit board, prepreg
-
Application No.: US16324199Application Date: 2017-08-22
-
Publication No.: US11114354B2Publication Date: 2021-09-07
- Inventor: Akira Ito , Eiichiro Saito , Kengo Yamanouti
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2016-173823 20160906
- International Application: PCT/JP2017/029840 WO 20170822
- International Announcement: WO2018/047613 WO 20180315
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/14 ; H01L23/12 ; H05K3/46 ; H01L23/15 ; H05K1/03 ; H05K1/02

Abstract:
A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from ¼ to ¾, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.
Public/Granted literature
- US20190214321A1 PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, PREPREG Public/Granted day:2019-07-11
Information query