Examples described herein provide techniques for multi-die device structures having improved gap uniformity between neighboring dies. In some examples, a first die and a second die are attached to an interposer. A first gap is defined by and between the first die and the second die. At least one of the first die or the second die is etched at the first gap. The etching defines a second gap defined by and between the first die and the second die. The first die, the second die, and the interposer are encapsulated with an encapsulant. The encapsulant is disposed in the second gap.