Invention Grant
- Patent Title: Electronic device, method of manufacturing electronic device, and electronic apparatus
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Application No.: US16392797Application Date: 2019-04-24
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Publication No.: US11114418B2Publication Date: 2021-09-07
- Inventor: Taiki Uemura , Taiji Sakai , Seiki Sakuyama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/07 ; H01L25/00 ; H01L23/00 ; H01L23/473 ; H01L23/538 ; H01L25/18 ; H01L25/065 ; H01L23/467
Abstract:
An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.
Public/Granted literature
- US20190252357A1 ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2019-08-15
Information query
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