Invention Grant
- Patent Title: Packaging of radiation detectors in an image sensor
-
Application No.: US16919511Application Date: 2020-07-02
-
Publication No.: US11114425B2Publication Date: 2021-09-07
- Inventor: Peiyan Cao , Yurun Liu , Chongshen Song
- Applicant: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L25/16 ; A61B6/14 ; A61B6/00 ; G01N23/046 ; G01N23/10 ; G01N23/18 ; G01N23/203 ; G01T1/24 ; H01R12/52 ; H01R12/71 ; G01N23/20091 ; G01N23/2252

Abstract:
Disclosed herein is an image sensor comprising: a first package comprising a plurality of radiation detectors mounted on a printed circuit board (PCB); wherein a dead zone of the first package does not extend between neighboring radiation detectors among the plurality of radiation detectors; wherein the radiation detectors have no guard rings or sidewall doping.
Public/Granted literature
- US20200335485A1 PACKAGING OF RADIATION DETECTORS IN AN IMAGE SENSOR Public/Granted day:2020-10-22
Information query
IPC分类: