Invention Grant
- Patent Title: Semiconductor structures and methods of forming the same
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Application No.: US16689923Application Date: 2019-11-20
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Publication No.: US11114532B2Publication Date: 2021-09-07
- Inventor: Cheng-Wei Chou , Hsin-Chih Lin , Yu-Chieh Chou , Chang-Xiang Hung
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch LLP
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/66 ; H01L29/778

Abstract:
A semiconductor structure is provided. The semiconductor structure includes: a substrate; a source structure and a drain structure disposed on the substrate; a gate structure disposed on the substrate and between the source structure and the drain structure; a first field plate disposed on the substrate; a first oxide layer disposed between the substrate and the first field plate; a second field plate disposed on the first field plate, wherein the second field plate is closer to the drain structure than the first field plate; a planarized second oxide layer disposed between the first oxide layer and the second field plate; and a third field plate disposed on the second field plate, wherein the third field plate is closer to the drain structure than the second field plate.
Public/Granted literature
- US20210151571A1 SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME Public/Granted day:2021-05-20
Information query
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