- Patent Title: Integrated circuit devices and methods of manufacturing the same
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Application No.: US16152956Application Date: 2018-10-05
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Publication No.: US11114535B2Publication Date: 2021-09-07
- Inventor: Hak-yoon Ahn , Sang-hyun Lee , Sung-woo Kang , Hong-sik Shin , Seong-han Oh , Young-mook Oh , In-keun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2018-0035362 20180327
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/8234 ; H01L29/78 ; H01L21/033 ; H01L27/088 ; H01L29/165 ; H01L29/45 ; H01L21/768 ; H01L21/311 ; H01L29/66 ; H01L21/02 ; H01L29/08

Abstract:
A semiconductor device may include a substrate including a fin active region extending in a first direction, a gate structure crossing the fin active region and extending in a second direction crossing the first direction, source/drain regions on the fin active region at opposite sides of the gate structure, a first contact structure electrically connected to one of the source/drain regions, a pair of first contact block structures on opposite first sidewalls, respectively, of the first contact structure in the second direction.
Public/Granted literature
- US20190305098A1 INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2019-10-03
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