Invention Grant
- Patent Title: Colored thin covering film and manufacturing method
-
Application No.: US15841448Application Date: 2017-12-14
-
Publication No.: US11116074B2Publication Date: 2021-09-07
- Inventor: Wei-Chih Lee , Li-Chih Yang , Chien-Hui Lee
- Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.
- Applicant Address: TW Hsinchu County
- Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.
- Current Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.
- Current Assignee Address: TW Hsinchu County
- Agency: Amin, Turocy & Watson, LLP
- Priority: CN201710102125.9 20170224
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/28 ; B32B27/08 ; B32B27/32

Abstract:
A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 μm, and the thickness of the low dielectric glue layer is between 3 to 25 μm, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 μm. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.
Public/Granted literature
- US20180249572A1 COLORED THIN COVERING FILM AND MANUFACTURING METHOD Public/Granted day:2018-08-30
Information query